Browsing by Author Halavar, B.
Showing results 6 to 6 of 6
< previous
Issue Date | Title | Author(s) | Supervisor(s) |
---|---|---|---|
2018 | Thermal Aware Design for Through-Silicon Via (TSV) based 3D Network-on-Chip (NoC) Architectures | Pasupulety, U.; Halavar, B.; Talawar, B. | - |